近五年(2018-2022)发表的期刊论文：
(1) Bo Wang; Kailin Pan*; Yubing Gong; Yuhong Long; Kai Shi ; Effect of
ultrasonic power on wettability, porosity and mechanical properties of
ultrasonic-aided laser reflow soldering, International Journal of Modern
Physics B, 2021, 35(5) (SCI)
(2) Wei Huang; Kailin Pan*; Jian Zhang; Yubing Gong ; Effect of In-Doping on Mechanical
Properties of Cu6Sn5-Based
Intermetallic Compounds: A First-Principles Study, Journal of Electronic Materials, 2021,
50: 4164-4171 (SCI)
(3) Bo Wang; Wangyun Li; Kailin Pan* ; Shear performance of microscale
ball grid array structure Sn–3.0Ag–0.5Cu solder joints with
different surface finish combinations under electro-thermo- mechanical coupled
loads, Journal of Materials Science: Materials in Electronics, 2022, 10: 1007 (SCI)
(4) Wei Huang; Kailin Pan*; Jian Zhang; Yubing Gong ; Strain Rate and
Temperature Effects on Tensile Properties of Polycrystalline Cu6Sn5 by
Molecular Dynamic Simulation, Crystals, 2021, (11): 1415(SCI)
(5) Bo Wang; Wangyun Li; Kailin Pan* ; Abnormal Shear Performance of
Microscale Ball Grid Array Structure Cu/Sn–3.0Ag–0.5Cu/Cu
Solder Joints with Increasing Current Density, Crystals, 2022,12: 85(SCI)
(6) Huang, Wei; Pan, Kailin*; Wang, Bo; Gong, Yubing, Grain
Size Effects on Mechanical Properties of Nanocrystalline Cu6Sn5Investigated
Using Molecular Dynamics Simulation. Materials, 2022, 15(11）:3889(SCI)
(7) 潘开林,黄伟，程浩，郭琛，功能化石墨烯/聚二甲基硅氧烷复合材料及其力学性能的分子动力学模拟，高分子材料科学与工程，2020, 36（6）：97-101（EI期刊）
（8）王文惠,潘开林*,范凯,龚似明.柔性可延展耦合电路互连结构频域与时域特性分析[J].微纳电子技术,2019,56(08):597-601.（中文核心）
（9）王文惠,潘开林*,龚似明,范凯.柔性可延展电路中互连结构设计及布局优化[J].微纳电子技术,2019,56(09):691-696.（中文核心）
（10）韩旭峰,潘开林*,曹威武,王文佳,李婷婷.可延展电子Peano型通用互连结构对角拉伸延展性分析[J].微纳电子技术,2018,55(04):290-295+301.（中文核心）
（11）王文惠,潘开林*,龚似明,范凯.可延展电子通用金属互连结构电学特性分析[J].现代电子技术,2019,42(24):59-62+66.（中文核心）
（12）郭琛,潘开林,程浩.热电制冷技术的研究进展[J].微纳电子技术,2018,55(12):927-931.（中文核心）
近五年（2018-2022）发表的会议论文
（1） Gong S, Pan K, Wang W, et al. Research of inkjet printing process for flexible electronic interconnect structures[C]// 2018 19th International Conference on Electronic Packaging Technology (ICEPT). 2018.
（2） Fan K, Pan K, Gong S, et al. Molecular Dynamics Study of the interaction energy at the composite interface between PDMS and functionalized Graphene using molecular dynamics simulations[C]// 2018 19th International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2018.
（3） Wang W, Pan K, Gong S, et al. Design and Layout Optimization of the Interconnection Structure of Stretchable Circuits[C]// Proceedings of the 2019 International Conference on Wireless Communication, Network and Multimedia Engineering (WCNME 2019). 2019.
（4）Pan K, Zheng Y. Simulation Analysis of Laser Soldering Temperature Field[C].2019 7th Asia International Symposium on Mechatronics.2020, 588：279-288
（5） Li T, Pan K, Tan Z, et al. Simulation and Experimental Study of the Temperature Field of Solder Ball in the Nozzle during Laser Jet Solder Ball Bonding Process[C]// 2020 21st International Conference on Electronic Packaging Technology (ICEPT). 2020.
（6）Ou W, Pan K. Thermal Reliability Analysis and Structure Optimization of BGA Solder Joint Based on Genetic Algorithm[C]//Proceedings of the Eighth Asia International Symposium on Mechatronics. Springer, Singapore, 2022: 1356-1365.
（7）Zhang J, Huang W, Pan K L. Strain rate and temperature effects on tensile properties of monocrystaline Cu 6 Sn 5 by molecule dynamic simulation[C]//2021 22nd International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2021: 1-4.
（8）Zhang Q, Pan K. Study on Laser Energy Absorption Efficiency of Solder Ball Based on Ray Tracing Method and Its Influencing Factors[C]//Proceedings of the Eighth Asia International Symposium on Mechatronics. 2022: 1282-1290.
（9）Wang B, Li W Y, Huang W, et al. The breakdown of Anand constitutive model in life prediction of microscale BGA structure Sn–3.0 Ag–0.5 Cu joints stressed with electric current[C]//2022 23rd International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2022: 1-6.
（10）Zhang Q, Pan K. Analysis of the Effect of Hygrothermal Stress on Delamination of Plastic Sealed Devices[C]//2022 23rd International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2022: 1-5.
2017年发表的论文：
1.潘开林, 杨帆, 秦晴, 李婷婷, 曹威武. 可延展柔性电子基底分析[J]. 微纳电子技术. 2017, 54(9):591-596
2.杨帆, 潘开林, 王文佳, 秦晴, 韩旭峰. 可延展电子中聚合物/铜纳米复合材料多尺度分析[J]. 电子技术. 2017, 46(5).
3. Wenjia Wang, Kailin Pan, Tingting Li, et al. Delamination behavior of an end-linked PDMS/copper interface: a molecular dynamics study: 2017 18th International Conference on Electronic Packaging Technology, ICEPT 2017[C]. IEEE, 2017:1542-11546. (ISBN: 978-1-5386-2972-7; DOI: 10.1109/ICEPT.2017.8046729)
4.Tingting Li, Kailin Pan, Wenjia Wang, et al. The effects of encapsulation on fatigue lifetime of stretchable interconnects under uniaxial cyclic tensile loading by finite element methods: 2017 18th International Conference on Electronic Packaging Technology, ICEPT 2017[C]. IEEE, 2017:1557-1560. (ISBN: 978-1-5386-2972-7; DOI: 10.1109/ICEPT.2017.8046732)
5. 曹威武, 潘开林, 韩旭峰, 李婷婷, 王文佳. 柔性基底导电银墨水喷墨打印工艺分析[J]. 微纳电子技术. 2017(11).
2016年发表的论文：
1. Qin Q, Pan K, Yang F, et al. Effect of universal interconnect's geometrical parameters on metal-elastomer interface strength: 2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016[C]. IEEE, 2016170-174.(ISBN-13: 9781509013968; DOI: 10.1109/ICEPT.2016.7583113)
2.左锋, 潘开林, 秦晴, 杨帆, 蒋廷彪. 可延展电子金属导线通用互连结构延展性表征研究[J]. 机电工程. 2016(07): 888-894.
3.王琳, 潘开林, 左锋, 韦志川. 可延展结构性基底力学特性分析[J]. 微纳电子技术. 2016(08): 503-507.
2015年发表的论文：
4. Chen R, Pan K, Lin H, et al. Ductility of thin metal film on a polymer substrate for stretchable electronics[J]. Material Research Innovations, 2015, 19. (EI:20154801625707) (ISSN: 14328917.E-ISSN: 1433075X)
5.Pan K, Chen R, Guo Y, et al. Impact of light-emitting diode chip material properties on photoelectric properties under low temperature[J]. Material Research Innovations, 2015, 19. ( EI:20154801625819) ( ISSN: 14328917)
6.Benshuai G, Bin Z, Kailin P. Optimal design of VFBGA mixed solder joints under random vibration[C]// International Conference on Electronic Packaging Technology. IEEE, 2015. ( EI:20160701931591)( ISBN-13: 9781467379991)
7.Lin H, Pan K, Yang F, et al. Analysis of stress concentration phenomenon in stretchable interconnects[J]. 2015, 8: 760-763.(ISSN: 23525401)( ISBN:9789462520622)
8.林骅，潘开林，陈仁章，等. 可延展柔性无机电子互连结构及其力学特性[J]. 微纳电子技术. 2015(06): 341-347.
2014年发表的论文：
9.Kailin Pan，Hua Lin，Yu Guo，Renzhang Chen，Xin Wang，Bin zhou, Research on Design of the Heat Dissipation Structure of A Typical 100W HP-LED Streetlight, Energy education science and technology part a: energy science and research, Vol.2014,32(3),P1765-1778. (ISSN:1308772X) (EI:20142317785658)
10.Kailin Pan，Yu Guo，GuotaoRen，Hua Lin, Heat Multi-chip Module High Power LED Integrated Packaging with Through Silicon Vias, Information Technology Journal,Vol.2014,13(7),P1316-1322, (ISSN:18125638, E-ISSN:18125646) SCI DOI: 10.3923/itj.2014.1316.1322
11. Kailin Pan，Hua Lin，Yu Guo，Na Wei，Tao Lu，Bin zhou, Study on the Thermal Resistance of Multi-chip Module High Power LED Packaging Heat Dissipation System, Sensors & Transducers Journal，Vol.2014, 180(10), P72-79, (ISBN-13: 9781457717680)
12.Kailin Pan，Yu Guo，Weitao Zhu，Xin Wang，Bin zhou, Study on Reliability and Lifetime Prediction of High Power LEDs, TELKOMNIKA Indonesian Journal of Electrical Engineering Vol.2014,12(2),P 1132-1142,（ ISSN：23024046，E-ISSN:2087278X）
13.Yu Guo，Kailin Pan，Hua Lin，Thermal Fatigue Analysis and Life Prediction of PBGA Solder Joints，WIT Transactions on Engineering Science, Vol.2014,87,P 197-204,( ISSN: 17433533)(EI: 20141217483456)
14.Fei Yuan，Kailin Pan，Tao Lu，Xin Wang，Bin zhou, Study on Thermal Degradation of High Power LEDs During High Temperature and Electrical Aging.WIT Transactions on information and communication technologies (EI：20160701940068), Vol2014，62,P335-342, ( ISSN:17433517)
15. Tao Lu，Bin zhou，Kailin Pan，Yunfei En，Yubin Gong, Harmonic Vibration Analysis and S-N Curve Estimate of PBGA Mixed Solder Joints,2014 15th International Conference on Electronic Packaging Technology, Vol.2014,P 778-782, (EI: 20144400134017)
16. Xin Wang，Xunping Li，Kailin Pan，Bin zhou，Tingbiao Jiang, Effect of Pb Content on Shear Performance of SnAgCu-xSnPb/Cu Mixed Solder Joint, 2014 15th International Conference on Electronic Packaging Technology, Vol.2014,P 1173-1176, (EI: 20144400134035)
17. Na Wei，Kailin Pan，Hua Lin，Renzhang Chen，Benshuai Guo, Optimistic Design of Freestanding Horseshoe Metal Interconnects for Stretchable Electronic Circuits,2014 15th International Conference on Electronic Packaging Technology,Vol2014,P1526-1529, (EI: 20144400134115)
18.Tao Lu，Bin zhou，Kailin Pan，Yubin Gong, Optimal design of PBGA mixed solder joints under random vibration,2014 6th International Chemometrics Research Meeting (EI: 20152700998665),Vol2014
19.Xin Wang，Xunping Li，Kailin Pan，Bin zhouTingbiao Jiang, Effect of reflow profile parameters on shear performance of Sn3.0Ag0.5Cu/Cu solder joint,2014 6th International Chemometrics Research Meeting(EI: 20152700998661),Vol2014
20.Xin Wang，Xunping Li，Kailin Pan，Bin zhouTingbiao Jiang, Influence mechanism of pad type on the shear performance of Sn3.0Ag0.5Cu/Cu solder joint,2014 6th International Chemometrics Research Meeting(EI：20152700998812),Vol2014
21. 潘开林, 林骅, 陈仁章,陈显平，可延展无机柔性电子互连结构设计及力学特性研究[C]// 2014中国高端SMT学术会议.2014.